The ultra-low-power NuRAM/SmartMem compute-in-memory technology implements MRAM to overcome memory bottlenecks.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

An eFPGA is an FPGA that’s embedded into an ASIC to provide one or more programmable-logic fabrics for flexibility and ...

Vehicle-to-everything (V2X) technology transforms automotive connectivity and safety, but it requires robust storage ...

Infineon’s full/half-bridge driver ICs are qualified for automotive applications, feature a wide temperature range, and have ...

Additive manufactured electronics is grabbing the attention of the electronics industry. Nano Dimension’s Zvika Avlon ...

Most augmented- and virtual-reality (AR/VR) systems present an image on a plane in front of the eye. TDK was showing off an ...

Vibration and thermal signatures are crucial toward gaining a deeper understanding of failure modes in process operations and ...

InductEV and Skien Norway's ENRX have signed an MOU that seeks to establish technical standards and ensure compatibility ...

Get up close and personal with some of the world’s most interesting insects and the micro worlds they call home in Nat Geo’s ...

An eFPGA is an FPGA that’s embedded into an ASIC to provide one or more programmable-logic fabrics for flexibility and cost/performance benefits. How advanced IC designs are replacing board ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI. The semiconductor companies and startups on the front lines of the ...